UVblade

Laser Lift-Off Processing

Laser Lift-Off separation is the enabling technology in manufacturing of flexible displays. UVblade gently detaches delicate polymer-based displays of all types from their rigid glass carriers. UVblade is available at line beam lengths supporting fast and effective separation of substrates and wafers.

Systems for Laser Lift-Off Applications

UVblade gently detaches delicate polymer-based displays of all types from their rigid glass carriers. Laser Lift-Off separation is the enabling technology in manufacturing flexible displays. UVblade is available at line beam lengths supporting fast and effective separation of substrates and wafers.

Applications

Application

Laser Lift-Off

Features & Benefits


UVblade Model
UVblade 250
UVblade 380
UVblade 465
UVblade 750
UVblade 1000
Wavelength (nm)
308
308
308
308
308
Laser Pulse Energy (mJ)
580
580
1000
1000/2000 (high power model)
2000
Repetition Rate (Hz)
200
200
600
600
600
Energy Density (mJ/cm2)
370
340
330
340/320 (high power model)
315
Beam Length (mm)
250
380
465
750
950
Beam Width (µm)
400
300
400
250/500 (high power model)
400
Homogeneity Long Axis (%, 2 sigma)
1.8
1.8
1.8
1.8
1.8
Steepness Short Axis (µm)
100
70
125
70/125 (high power model)
85
Depth of Focus (µm)
±200
±200
±150
±100/±150 (high power model)
±100

UVblade Key Features
Cost Effective Laser Optical Solutions for Laser Lift-Off (LLO)
Pulse on Demand (POD)
Highest Beam Utilization
Homogeneous Energy Distribution
Scalability in Line Lengths and Energy Density

Related Materials